Semiconductor Industry

Semiconductor Industry: The Ultimate Expression of Precision & ESD Protection

(Tailored for semiconductor manufacturing, packaging, testing, and automation equipment suppliers.)

Manufacturing Challenges & Material Pain Points

In semiconductor manufacturing, minute electrostatic discharges (ESD) can instantly destroy sensitive IC components, while aggressive chemical cleaning and high-temperature testing accelerate the degradation of inferior materials. We deliver targeted material solutions for various process nodes:

Core Application Scenarios

  • Front-End Lithography & Wet Etching (Wet Bench):
    • Applications: Acid/alkali cleaning tanks, wafer fluoropolymer carriers, transport rails.
    • Requirements: Ultimate resistance to strong acids/alkalis (HF / H2SO4), high-temperature tolerance, and ultra-low extractables.
  • Back-End Packaging & Testing (Testing & Packaging):
    • Applications: IC test fixtures, IC trays, test sockets, and vacuum nozzles for automated robotic arms.
    • Requirements: Precise static dissipation capabilities (surface resistivity of 10^6 ~ 10^9 or 10^5 ~ 10^8 ohm), high rigidity, and excellent dimensional stability during machining.
Material TypeCommon Representative GradesCore PropertiesMain Application Fields
ESD POM
(防靜電聚甲醛)		• Semitron® ESd 225
• SUSTARIN C ESD 60/90		尺寸穩定性極佳、耐磨耗、高機械強度、表面電阻表現穩定自動化傳送軌道、IC 托盤、常溫檢測治具
ESD Nylon
(防靜電尼龍)		• MC501CD R6 / R2
• MC500AS (無碳白色)		機械加工性優異、高剛性；無碳粉添加型號絕不掉屑/污染環境半導體封測治具、無塵室自動化機械零件
ESD PEEK
(防靜電聚醚醚酮)		• Semitron® ESd 480
• TECAPEEK ELS
• ESD-WD0608-Ultra		超高耐溫（可達 250°C 以上）、極佳耐化學腐蝕性、極低出氣率（Outgassing）、低吸水率晶圓承載器（Wafer Carrier）、高溫 IC 測試插座、製藥充填組件
ESD PEI
(防靜電聚醚醯亞胺)		• Semitron® ESd 420
• SUSTAPEI ESD
• ESD-WD0608		高剛性、高介電強度、優異耐高溫性與精密尺寸穩定度高頻 IC 測試治具、電子設備高溫結構件
ESD PTFE / PVDF
(防靜電氟碳樹脂)		• Semitron® ESd 500HR
• Polystone® PVDF EL		頂級抗酸鹼耐腐蝕性、高純淨度、低摩擦係數半導體濕製程清洗槽、化學品與製藥輸送管道
純 PI（棒/板材）
(未填充聚醯胺-醯亞胺)		• Vespel® SP-1
• WD-P00G		極高溫下具備優異絕緣性、絕熱（隔熱）性與高機械穩定性絕緣墊片、絕緣套筒、高溫隔熱支撐件、測試座絕緣零件
PI + 15% 石墨
(石墨填充聚醯胺-醯亞胺)		• Vespel® SP-21
• WD-P15G		低摩擦係數、耐磨耗、具備自潤滑性與滑動承載能力軸套、滑動軸承、止推墊片、高溫耐磨導向塊
PI + 30% 玻纖
(玻纖強化聚醯胺-醯亞胺)		• TECASINT® 5051
• WD5051PI30G		極高剛性、電氣絕緣性、超低熱膨脹率（低變形）與優異尺寸穩定性IC 測試座本體（Socket Body）、接觸針支撐板、精密定位板、高溫絕緣支撐件
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